-Specialist in Thin Film Technology-
Susumu Deutschland GmbHRecommended reflow soldering profile
Recommended reflow soldering profile
Product surface temperature
| pre-heating | 130 ～ 180℃ 60 ～ 90sec. |
|---|---|
| Reflow | above 220℃ 30 ～ 90sec. |
| Peak temperature |
240 ～ 250℃ Maximum 10 seconds ・Applicable solder composition：Sn－Ag－Cu solder paste ・Cycles : twice (cooling between 1st and 2nd cycles) |
Recommended flow soldering profile
Product surface temperature
| pre-heating | 100℃～ 120℃ 60 ～ 80 sec |
|---|---|
| Peak temperature |
255℃～ 265℃ aximum 5 seconds ・Applicable solder composition：Sn－Ag－Cu solder paste ・Cycles : twice |
Technical Information
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- 1.Basic knowledge of resistors
- 2.Manufacturing methods and characteristics of thin film resistors
- 3.Performance characteristics of thin film resistors
- 4.High precision and high reliability
- 5.Trimmable chip resistors and altering resistive values
- 6.Application and recommended usage of thin film chip resistors
- 7.Application and recommended usage of small high power thin film ship resistors
- 8.Various methods of current sensing and advantage of current sensing resistors
- 9.Application and recommended usage of current sensing resistors
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Susumu Deutschland GmbH
