Low Value Chip Resistor RL series |
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A compact Low Value Chip Resistor for current sensing |
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YDSs Low Value Chip Resistor enables to surface mount on the aluminum substrate easily by thin film
techniques. New developed nichel alloy is used, which has high stability
and fine temperature characteristics in order to have low TCR and high
stability. |
Features |
High ability to sense the current; ±1.0% of precision guaranteed
Small temperature coefficient; in resistance to ±100ppm/deg.C
guaranteed Easy automatic mounting because of surface mount type with
round wrapped electrode; taped serving High precision and stability because of high precision thin
film and manufacturing methods of it Big overload causes breaking of wire so it is safe for unexpected
overload. Low price achieved by thin film manufacturing method |
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Dimension |
|
(1) Electrode (2) Protection coat (3) Aluminum substrate (4) Resistor (5) Marking |
RL1632 (mm) |
RL2550 (mm) |
RL3264 (mm) |
|
W |
1.6±0.2 |
2.5±0.2 |
3.2±0.2 |
L |
3.2±0.2 |
5.0±0.2 |
6.4±0.2 |
T |
0.5±0.15 |
0.5±0.15 |
0.5±0.15 |
a |
1.0±0.2 |
1.7±0.2 |
2.1±0.2 |
b | 0.55±0.2 | 0.9±0.2 | 1.2±0.2 |
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Specification |
Item |
RL1632 |
RL2550 |
RL3264 |
Power Rating(Derating Curve???Figure-1) |
0.5W |
0.75W |
1.0W |
Resistance Value for Current Sensing(Note1) |
10m~500mO |
10m~500mO |
10mO~500mO |
Resistance Tolerance |
10m~15mO : ±2.0%(G) 16mO~500mO : ±1.0%(F) , ±2.0%(G) |
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Temperature Coefficient of Resistance |
10m~ 15mO : 0~+500ppm/deg.C 16m~ 24mO : 0~+350ppm/deg.C 25m~ 49mO : 0~+200ppm/deg.C 50m~ 500mO : 0~+100ppm/deg.C |
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Maximum over current |
I=v(32/R) [ A ] Maximum current : 32A |
I=v(50/R) [ A ] Maximum current: 40A |
I=v(64/R) [ A ] Maximum current 45A |
R = Resistance Value(O) Applied for 10ms or less (pause of 60ms or more) |
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Operating Temperature Range |
-40~+125deg.C |
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Rated Ambient Temperature |
+70deg.C (Derating Curve Figure-1) |
Figure 1...Derating Curve
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Characteristics |
Item |
Conditions |
Specification |
Short Time Over Load |
Voltage of 2.5 times the rated voltage shall be applied for 5s. |
±(0.5% +0.0005O) |
Load life |
Rated voltage for 90min followed by a pause of 30min at a temperature of
70±3deg.C. Cycles shall be repeated for 1000H. |
±(0.5% +0.0005O) |
Moisture Load life |
Rated voltage for 90min followed by a pause of 30min at a temperature of
60±2deg.C with relative humidity of 90~95%. Cycles shall be repeated for 1000h. |
±(0.5% +0.0005O) |
Temperature Cycle |
|
±(0.5% +0.0005O) |
Soldering Heating |
Dipped into solder for 10±1sec at 260±5deg.C |
±(0.5% +0.0005O) |
Substrate Bending |
Between fulcrums :90mm Bend width : 2mm Glass-epoxy board t=1.6mm |
±(0.5% +0.0005O) |
Solderability |
Dipped into solder for 3±0.5sec at 235±5deg.C |
95% or more of the substrate surface should be wet. |
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Packaging |
|
Dimension (mm) |
|||
RL1632 |
RL2550 |
RL3264 |
|
A |
2.0±0.2 |
2.9±0.2 |
3.43±0.2 |
B0 |
3.6±0.2 |
5.3±0.2 |
6.63±0.2 |
W |
8.0±0.3 |
12.0±0.3 |
12.0±0.3 |
F |
3.5±0.05 |
5.5±0.05 |
5.5±0.05 |
E |
1.75±0.1 |
1.75±0.1 |
1.75±0.1 |
P0 |
4.0±0.1 |
4.0±0.1 |
4.0±0.1 |
P1 |
4.0±0.1 |
4.0±0.1 |
4.0±0.1 |
P2 |
2.0±0.05 |
2.0±0.05 |
2.0±0.05 |
D0 |
1.5+0.1/-0 |
1.5+0.1/-0 |
1.5+0.1/-0 |
T |
0.3 or less |
0.3 or less |
0.3 or less |
T2 |
1.5 or less |
1.5 or less |
1.5 or less |
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Yokohama Densi Seiko Co., Ltd. |