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Recommended reflow and flow soldering profile

Recommended reflow and flow soldering profile

Recommended reflow soldering profile

Product surface temperature

pre-heating	130 ～ 180℃　60 ～ 90sec.
Reflow	above 220℃　 30 ～ 90sec.
Peak temperature	240 ～ 250℃　Maximum 10 seconds ・Applicable solder composition：Sn－Ag－Cu　solder　paste ・Cycles : twice (cooling between 1st and 2nd cycles)

Recommended flow soldering profile

Product surface temperature

pre-heating	100℃～ 120℃　60 ～ 80 sec
Peak temperature	255℃～ 265℃　aximum 5 seconds ・Applicable solder composition：Sn－Ag－Cu solder paste ・Cycles : twice

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