New products information

Features

• Attenuation to high frequency range (up to 30GHz)
• Compatible with PAT series land patterns
• Lineup of various attenuations between 0 and 10 dB (1dB step)
• Compact size and low impedance mounting（1005size、face-down mounting）

Features

• Attenuation range up to 50GHz
• Internal circuit specially designed for 0-10dB attenuation.
• Miniature surface mount chip attenuator (1005,2012 size)
• Signal line sandwiched by ground – excellent heat dissipation and low noise.

Features

• A resistor that takes advantage of the characteristics of thin films, and supports a wide range of frequencies from DC to 30 GHz.
• Small 0603 size
• Face-down mounting type

Features

• High voltage operation is possible because the limiting element voltage is hjgh. (RGV3225 1000V)
• Long term stability with inorganic passovation.
• Resistance tolerance : ±0.1% , TCR : ±25 ppm/℃
• Thin film structure enabling low noise and anti-sulfur

Features

• Wide temperature operation (Upper category temperature :175°C）
• Long term stability with igorganic passivation
• Resistance tolerance : ±0.1% , TCR : ±10ppm/°C
• Thin film structure enabling low noise and anti-sulfur

Features

• Conductive epoxy compatible
• Operating temperature up to 230℃
• Resistance tolerance: ±0.1%, TCR: ±10ppm/℃
• Thin film structure enabling low noise and anti-sulfur

Features

• Conductive epoxy compatible chip resistor network
• Relative resistance tolerance: ±0.01%, relative TCR: ±1ppm/℃
• Operating temperature up to 230℃
• RoHS compliant, 100% lead free (gold terminal)
• Thin film structure enabling low noise and anti-sulfur

Features

• Single attenuating element realizes excellent attenuating characteristics
• Wide frequency range making it ideal to handle multiple frequency bands
• Terminal distribution (center signal terminal and ground terminal at both ends) are designed for easy connection.

Features

• Frequency range: DC to 20GHz
• Wide frequency band enables minimal pulse shape distortion and timing jitter
• Small and easy to mount
• Thin film design minimizes return loss
• Two type available: with ground or applicable to customer's board.

Features

• By adopting an aluminum nitride substrate, it has extremely excellent heat dissipation performance and realizes ultra-high power consumption.
• Wrap around terminals provide easy and reliable soldering.
• Thin film does not have any innate stress. Therefore, repeated power cycling does not fatigue the element and cause no change in impedance.

Features

• Efficient heat dissipation provides high power, anti-surge, overload protection.
• Wrap around terminals provide easy and reliable soldering.
• Thin film does not have any innate stress. Therefore, repeated power cycling does not fatigue the element and cause no change in impedance.