SUSUMU CO.,LTD.

Product technical report

HOMETechnical InformationProduct technical reportRecommended reflow temperature profile

Recommended reflow temperature profile

Recommended reflow temperature profile

■Part's surface temperature

Pre-heat 130~180°C 60~90sec.
reflow Over 220°C 30~90 seconds
peak temperature 240~250°C within 10 seconds

■Solder composition:Sn-Ag-Cu solder
■Repetition:up to 2 times
Cooling between the two reflow is required.


CONTACT JAPANESE HOME SUSUMU CO.,LTD.