Recommended reflow temperature profile
Part's surface temperature
| Pre-heat | 130～180℃ 60～90sec. |
|---|---|
| reflow | Over 220℃ 30～90 seconds. |
| peak temperature | 240～250℃ within 10 seconds. |
- Solder composition : Sn-Ag-Cu solder
- Repetition : up to 2 times
Cooling between the two reflow is required.
