How to make Thin Film?

SSM's Deposition Technology

Physical Method (PVD)

• Resistive heating evaporation (NiCr, Cu, Ni, Au etc.)
• lectron beam evaporation (Ni, Al etc.)
• Sputtering (NiCr, Cr Alloy, Cu)
• Ion plating (Ni, Cr etc.)

Chemical Method (CVD)）

• Plasma CVD (SiO2, SiN etc.)
• Plasma polymerization reaction (SiN etc.)

Others

• Electrolyte plating (Cu, Ni, Au, Solder etc.)
• Non-electrolyte plating (Au, Ni Alloy etc.)

Sputtering Method (Planer Magnetron)

Irradiate ions generated by glow discharge to the target Atom/molecular on the surface of target will be.
pushed out by ions and piled up onto the substrate.

Features

• High purity of thin film
• Suitable for thin film alloy
• High m.p. material usable
• Strong adhesion

Plasma CVD / Plasma polymerization reaction

Molecular will be decomposed or combined in the plasma by glow discharge, and deposited on the substrate as Thin Film.

Features

• Easier reaction in low temperature.
• Possible both organic film and non-organic film, as far as the material can be vaporized.
• Realizes pinhole free film.
• Suitable for non-crystalline thin film.