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How to use chip resistors smartly
- 1.Basic knowledge of resistors
- 2.Manufacturing methods and characteristics of thin film resistors
- 3.Performance characteristics of thin film resistors
- 4.High precision and high reliability
- 5.Trimmable chip resistors and altering resistive values
- 6.Application and recommended usage of thin film chip resistors
- 7.Application and recommended usage of small high power thin film ship resistors
- 8.Various methods of current sensing and advantage of current sensing resistors
- 9.Application and recommended usage of current sensing resistors
- Smart usage of High Frequency Chip Components
- Application Information
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Product Technical Report
Standard Specification for surface mount chip resistors
- Recommended land patterns
- Recommended reflow and flow soldering profile
- Dimensions of the packaging reel
- Dimensions of the packaging tape
Standard Specification for High frequency surface mount components
- Recommended reflow soldering profile
- Dimensions of the packaging tape
- Dimensions of the packaging reel
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Technical FAQ
High Precision Thin Film Chip Resistors
- ・Part numbering
- ・Performance characteristics
- ・Quality, reliability
- ・Mounting, packaging
Current sensing chip resistors
- ・Part numbering
- ・Performance characteristics
- ・Quality, reliability
- ・Mounting, packaging
- Company Profile
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QC and Environmental
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- Technical Information
- How to make thin film?
How to make thin film?
Susumu's Deposition Technology
- Resistive heating evaporation (NiCr, Cu, Ni, Au etc.)
- Electron beam evaporation (Ni, Al etc.)
- Sputtering (NiCr, Cr Alloy, Cu)
- Ion plating (Ni, Cr etc.)
- Plasma CVD (SiO2, SiN etc.)
- Plasma polymerization reaction (SiN etc.)
Others
- Electrolyte plating (Cu, Ni, Au, Solder etc.)
- Non-electrolyte plating (Au, Ni Alloy etc.)
Sputtering Method (Planer Magnetron)
Ions produced by glow discharge sputter out atoms and molecules from Target.
These atoms and molecules accumulate over substrate such as thin film.
Features
- High purity of thin film
- Suitable for thin film alloys
- High melting point material can be used
- Strong adhesion
Plasma CVD / Plasma polymerization reaction
Thin film is formed by decomposing and re-composing of molecules in plasma produced by glow discharge.
Features
- Normally difficult chemical reaction can be achieved in low temperature
- Can use both organic and non-organic materials as long as the materials can be vaporized
- Create pinhole free film
- Suitable for amorphous thin film
Technical Information
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- 1.Basic knowledge of resistors
- 2.Manufacturing methods and characteristics of thin film resistors
- 3.Performance characteristics of thin film resistors
- 4.High precision and high reliability
- 5.Trimmable chip resistors and altering resistive values
- 6.Application and recommended usage of thin film chip resistors
- 7.Application and recommended usage of small high power thin film ship resistors
- 8.Various methods of current sensing and advantage of current sensing resistors
- 9.Application and recommended usage of current sensing resistors
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Standard Specification for surface mount chip resistors
- Recommended land patterns (soldering footprints)
- Recommended reflow and flow soldering profile
- Dimensions of the packaging reel
- Dimensions of the packaging tape
-
Standard Specification for surface mount chip resistors
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- High Precision Thin Film Chip Resistors Current sensing chip resistors
Activity Contents
Technical Information
How to use chip resistors smartly
- 1.Basic knowledge of resistors
- 2.Manufacturing methods and characteristics of thin film resistors
- 3.Performance characteristics of thin film resistors
- 4.High precision and high reliability
- 5.Trimmable chip resistors and altering resistive values
- 6.Application and recommended usage of thin film chip resistors
- 7.Application and recommended usage of small high power thin film ship resistors
Standard Specification for surface mount chip resistors
- Recommended land patterns
- Recommended reflow and flow soldering profile
- Dimensions of the packaging reel
- Dimensions of the packaging tape
Standard Specification for High frequency surface mount components
Smart usage of High Frequency Chip Components
Susumu International U.S.A. -Specialist in Thin Film Technology-