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1.What is Thin Film ?
■What is Thin Film ?
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Needs substrate
- Can not stand by alone
- Characteristics depend on the surface condition of the substrate
Enough thin to change properties
- Thin film features mostly comes from its thickness
Formed through atom/molecular state
- Formed after decomposing the materials into atomic/molecular scale by physical and/or chemical measures
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■Comparison between Thin film and Human |
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■Features of Thin Film |
| Properties |
Extraordinary Phenomena |
Application |
| Electron Transportation |
Increase of resistivity
Decrease of temperature coefficient |
Thin film resistors |
| Magnetism |
Amplitude and maximal of electro-magnetic characteristics |
Magnetic memory |
| Super Conductivity |
Tunnel effect |
Josephson device |
| Optics |
Dependence of reflection and absorption rate to wavelength |
Anti-reflection coating |
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2.How to make Thin Film ?
■SSM's Deposition Technology |
| Physical Method (PVD)
- Resistive heating evaporation (NiCr,Cu,Ni,Au etc.)
- lectron beam evaporation (Ni,Al etc.)
- Sputtering (NiCr,Cr Alloy, Cu)
- Ion plating (Ni,Cr etc.)
Chemical Method (CVD)
- Plasma CVD (SiO2, SiN etc.)
- Plasma polymerization reaction (SiN etc.)
Others
- Electrolyte plating (Cu, Ni, Au, Solder etc.)
- Non-electrolyte plating (Au, Ni Alloy etc.)
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■Sputtering Method (Planer Magnetron) |
Irradiate ions generated by glow discharge to the target Atom/molecular on the surface of target will be pushed out by ions and piled up onto the substrate. |
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| Features
- High purity of thin film
- Suitable for thin film alloy
- High m.p. material usable
- Strong adhesion
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■Plasma CVD / Plasma polymerization reaction |
Molecular will be decomposed or combined in the plasma by glow discharge, and deposited on the substrate as Thin Film. |
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Features
- Easier reaction in low temperature
- Possible both organic film and non-organic film, as far as the material can be vaporized
- Realizes pinhole free film
- Suitable for non-crystalline thin film
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3.Features of Thin Film
■Properties of Thin Film |
| Uniformity |
・Uniformity between neighboring elements
・Minimum defects > Low noise
・Temperature stability, high precision |
| Thin |
・Minimum floating capacitance between neighboring elements
(Thickness 0.1µm -0.01µm) |
| Strong adhesion |
・Long term stability, temperature stability
・Tough terminal strength (More than double of the other method) |
| Processing |
・Micro processing, Precise processing
・Low profile multi-layer |
| Extraordinary |
・Linear temperature coefficient
・Hard protection coating with good edge covering
・Selectable crystalline and non- crystalline |
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■Features of Thin Film
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| High stability |
・Uniformity between neighboring elements
・Temperature stability, high precision, long term stability |
| High frequency |
・Minimum and uniform floating capacitance
・Low noise, wide frequency characteristics
・Thin and small, stable termination |
| Environmental |
・Long term stability, temperature stability
・Tough terminal strength
・High stable protection thin film |
| Miniature size |
・Micro processing, precise processing
・New functions by multi-layer
・Low profile thin film multi-layer |
| Low cost |
・Total cost saving by energy saving, high stability, high precision |
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Technical Information
